The thin film circuit ceramic package substrate is a technique of metallization and electroplating process by magneised sputtering art: that is, according to the application needs, in high thermally conductive ceramic matrix, a film metallization and image transfer mode is made of 2D metal line, and then adopted TCV (Through Ceramic VIA) technology forms a vertical interconnection between double-sided wiring, and finally, a stacked technique is used to obtain a integrated 3D metal frame with a ceramic matrix binding. Based on the thin film circuit process, the ceramic surface metallization is achieved by magnetron sputtering. The thickness of the copper layer and the gold is greater than 10 microns, which is more than 10 microns, and the DPC (DirectPlateCopper-direct copper plating substrate).

● The solder resistability of the substrate is high.  
● The thickness of the conductive layer is destined within 1 um ~ 1mm.  
● Thin lines, the minimum thread distance reaches 0.05mm, thereby realizing short, small, light and thin  
● Complete, lower-resistant metal film  
● The copper layer does not contain the oxide layer, which can be used in a reduction of the inner.